Grain Orientation and Prediction of Thermal Shock Fatigue of Sn-3Ag-0.5Cu Solder Joints for Fan-Out Wafer Level Packaging
Author:
Affiliation:
1. Harbin Institute of Technology,State Key Laboratory of Advanced Welding and Joining,Harbin,China
2. KAIST,Department of Materials Science and Engineering,Daejeon,South Korea
Funder
Natural Science Foundation of China
Chinese Academy of Sciences
National Key Research and Development Program of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195501.pdf?arnumber=10195501
Reference29 articles.
1. In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint
2. Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: a recent review[J];wang;J Advanced Joining Processes,2022
3. Reliability Simulation and Life Prediction of Sn63Pb37 BGA Solder Joint Under Thermal Cycling Load
4. Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock
5. Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints
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1. Effects of neutron irradiation on failure behavior analysis of high-density bumps under thermo-coupling conditions;Materials Science in Semiconductor Processing;2024-07
2. Reliability and thermal fatigue life prediction of solder joints using nanoindentation;Materials Today Communications;2024-06
3. Effect of proton irradiation damage on SnAg/Cu microbump simulation using Monte Carlo method;Microelectronics Reliability;2024-05
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