Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints-Reference-Cited by-同舟云学术

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Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints

Published:2022-06 Issue:2 Volume:22 Page:239-247
ISSN:1530-4388
Container-title:IEEE Transactions on Device and Materials Reliability
language:
Short-container-title:IEEE Trans. Device Mater. Relib.

Author:

Hani Dania Bani¹,Al Athamneh Raed²^ORCID,Hamasha Sa'd³^ORCID

Affiliation:

1. Department of Industrial Engineering, Yarmouk University, Irbid, Jordan

2. Department of Industrial Engineering, Faculty of Engineering, The Hashemite University, Zarqa, Jordan

3. Department of Industrial and Systems Engineering, Auburn University, Auburn, AL, USA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/7298/9789687/09744026.pdf?arnumber=9744026

Reference41 articles.

1. Thermal cycling reliability of lead free solders for automotive applications

2. Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

3. Dependence of SnAgCu solder joint properties on solder microstructure

4. Interfacial intermetallic growth and shear strength of lead-free composite solder joints

5. Cyclic Plastic Strain Energy and Fatigue of Metals

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influence of Nickel and Bismuth Addition on the Mechanical Shear Strength of SAC+ Ni, Bi Solders under Isothermal Aging and Multiple Reflows;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Melting Characteristic, Wettability, Interfacial Reaction, and Shear Property of Ball Grid Array Structure Cu/Sn_0.3Ag_0.7Cu/Cu Solder Joints With Ni-Modified Carbon Nanotubes;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-08

3. Neural-fuzzy machine learning approach for the fatigue-creep reliability modeling of SAC305 solder joints;Scientific Reports;2023-05-26

4. Grain Orientation and Prediction of Thermal Shock Fatigue of Sn-3Ag-0.5Cu Solder Joints for Fan-Out Wafer Level Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model;Scientific Reports;2023-02-13

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