Interfacial intermetallic growth and shear strength of lead-free composite solder joints
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference40 articles.
1. Interdiffusion analysis of the soldering reactions in Sn-3.5Ag/Cu couples
2. Microstructural engineering of solders
3. Creep properties of Sn-Ag solder joints containing intermetallic particles
4. High Strength Lead-Free Composite Solder Materials using Nano Al2O3 as Reinforcement
5. Dispersion strengthening for dimensional stability in low-melting-point solders
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