Subject
Condensed Matter Physics,General Materials Science
Reference26 articles.
1. Official Journal of the European Union 2003, L37/24.
2. Lead-free solders and processing issues in microelectronics
3. K Hwa and C. P. Wei, US patent application filed, Jan 2003.
4. K. J. Puttlitz, K A. Stalter, Handbook of lead-free solder technology for micro-electronic assemblies, 2004.
5. G. A. Henshall, L. W. Lindsley, Proceedings of the IEEE International Symposium on Electronics & the Environment, 2001, 296.
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