Depth profiles of secondary defects of As+ and BF2+ implanted silicon measured by a thermal wave technique
Author:
Publisher
Elsevier BV
Subject
Instrumentation,Nuclear and High Energy Physics
Reference7 articles.
1. Proc. 13th Int. Conf. on Defects in Semiconductor;Cerofolini,1985
2. The effect of implant species on defect anneal kinetics part II: Arsenic and germanium implantation
3. Influence of thermal history on the residual disorder in implanted <111> silicon
4. Ion implant monitoring with thermal wave technology
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Defect engineering of p+-junctions by multiple-species ion implantation;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1993-04
2. Damage analysis and engineering for ion implantation in ULSI process;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1993-04
3. A Novel Atomic Force Microscopy Observation Technique for Secondary Defects of Ion Implantation, using Anodic Oxidation;Japanese Journal of Applied Physics;1993-02-01
4. Defect engineering of p+-junctions by multiple-species ion implantation;Ion Implantation Technology–92;1993
5. Damage analysis and engineering for ion implantation in ULSI process;Ion Implantation Technology–92;1993
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