A novel interface strengthening layer: Nanoscale AuCu super-structure formed during Au80Sn20/Cu rapid solidification soldering process-Reference-Cited by-同舟云学术

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A novel interface strengthening layer: Nanoscale AuCu super-structure formed during Au80Sn20/Cu rapid solidification soldering process

Published:2018-01 Issue: Volume:135 Page:214-220
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Huang Yufeng,Liu Wensheng,Ma Yunzhu,Tang Siwei^ORCID,Wang Juan,Chen Baishan

Funder

National Natural Science Foundation of China

Creative research group of National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference24 articles.

1. Effect of Au-Sn IMCs' formation and morphologies on shear properties of laser reflowed micro-solder joints;Liu;Solder. Surf. Mt. Technol.,2015

2. Analysis of thermal characteristics and mechanism of degradation of flip-chip high power LEDs;Wang;Microelectron. Reliab.,2012

3. Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method;Yoon;Microelectron. Reliab.,2008

4. Die attach properties of Zn–Al–Mg–Ga based high-temperature lead-free solder on Cu lead-frame;Haque;J. Mater. Sci.,2012

5. A study on the heat dissipation of high power multi-chip COB LEDs;Wu;Microelectron. J.,2012

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhanced thermal stability of joints formed by Ag-Cu supersaturated solid-solution nanoparticles paste by in-situ Cu nanoprecipitates;Journal of Materials Science & Technology;2025-04

2. Influence of nickel plating on the welding metallurgical mechanism, microstructure, and shear performance of C101/80Au20Sn/C101 solder joints;Materials Characterization;2024-09

3. Pulse electric current induced interfacial ductile phase on improving the mechanical properties of the Au20Sn/Cu solder joints;Journal of Materials Science: Materials in Electronics;2024-06

4. Effect of Indium on Microstructures and Mechanical Properties of Bismuth-Based High Temperature Solders;MATERIALS TRANSACTIONS;2024

5. First-Principles Study on the Elastic Mechanical Properties and Anisotropies of Gold–Copper Intermetallic Compounds;Metals;2022-06-02

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