A study on the heat dissipation of high power multi-chip COB LEDs-Reference-Cited by-同舟云学术

A study on the heat dissipation of high power multi-chip COB LEDs

Published:2012-04 Issue:4 Volume:43 Page:280-287
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Wu Hsueh-Han,Lin Kuan-Hong,Lin Shun-Tian

Funder

National Science Council

Publisher

Elsevier BV

Subject

General Engineering

Reference27 articles.

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4. Advanced thermal enhancement and management of LED packages;Weng;Int. Commun.Heat Mass Transfer,2009

5. Lan Kim, Woong Joon Hwang, and Moo Whan Shin, Thermal resistance analysis of high power LEDs with multi-chip package, Proceedings – Electronic Components and Technology Conference 2006 (2006) pp. 1076–1081.

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