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Advanced thermal enhancement and management of LED packages

  • Published:2009-03 Issue:3 Volume:36 Page:245-248
  • ISSN:0735-1933
  • Container-title:International Communications in Heat and Mass Transfer
  • language:en
  • Short-container-title:International Communications in Heat and Mass Transfer

Author:

Weng Chun-Jen

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference7 articles.

1. Thermal and mechanical analysis of high power LEDs with ceramic packages;Hu,2007

2. High-power GaN LED chip with low thermal resistance;Hon,2008

3. High efficiency silicon-based high power LED package integrated with micro-thermoelectric device;Liu,2007

4. Thermal modeling and performance of LED packaging for illuminating device;Hwu,2006

5. Study on the Cooling enhancement of LED heat sources via an electrohydrodynamic approach;Chau,2007

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