Kinetic study of grain growth in highly (111)-preferred nanotwinned copper films-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Kinetic study of grain growth in highly (111)-preferred nanotwinned copper films

Published:2020-10 Issue: Volume:168 Page:110545
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Tseng Chih-Han,Tseng I-Hsin,Huang Yu-Pei,Hsu Yun-Ting,Leu Jihperng,Tu K.N.,Chen Chih

Funder

Ministry of Education

Ministry of Science and Technology, Taiwan

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference44 articles.

1. Multilevel interconnections for ULSI and GSI era;Murarka;Materials science and engineering: R: Reports,1997

2. Advanced multilayer metallization schemes with copper as interconnection metal;Murarka;Thin Solid Films,1993

3. Mechanisms for microstructure evolution in electroplated copper thin films near room temperature;Harper;J. Appl. Phys.,1999

4. Effects of crystallographic texture on stress-migration resistance in copper thin films;Koike;Appl. Phys. Lett.,2002

5. Microstructural influences on stress migration in electroplated Cu metallization;Sekiguchi;Appl. Phys. Lett.,2003

Cited by 25 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Abnormal grain growth of (110)-oriented perpendicular nanotwinned copper into ultra-large grains at low temperatures;Journal of Materials Science & Technology;2024-12

2. Effect of impurities on anisotropic grain growth in (111)-oriented nanotwinned copper;Materials Characterization;2024-08

3. Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu–Cu Bonding Interfaces Using (111)-Oriented Nanotwinned Copper;Materials;2024-07-02

4. Research Progress on the Texture of Electrolytic Copper Foils;Journal of Electronic Materials;2024-05-08

5. Effects of residual stress and microstructure on extremely anisotropic grain growth in nanotwinned Cu films;Materials Characterization;2024-05

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3