Microstructural influences on stress migration in electroplated Cu metallization
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1609238
Reference17 articles.
1. Thermal‐stress‐induced voiding in narrow, passivated Cu lines
2. Formation of Slit-Like Voids at Trench Corners of Damascene Cu Interconnects
3. Effects of linewidth, microstructure, and grain growth on voiding in passivated copper lines
4. Local crystallographic texture and voiding in passivated copper interconnects
5. Local textures and grain boundaries in voided copper interconnects
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