Thermal stability of microscale additively manufactured copper using pulsed electrodeposition
Author:
Funder
NSF-CMMI
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference18 articles.
1. Additive manufacturing of metal structures at the micrometer scale;Hirt;Adv. Mater.,2017
2. Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds;Hu;Science,2010
3. Localized pulsed electrodeposition process for three-dimensional printing of nanotwinned metallic nanostructures;Daryadel;Nano Lett.,2017
4. Template-free 3D microprinting of metals using a force-controlled nanopipette for layer-by-layer electrodeposition;Hirt;Adv. Mater.,2016
5. Dynamic “scanning-mode” meniscus confined electrodepositing and micropatterning of individually addressable ultraconductive copper line arrays;Lei;J. Phys. Chem. Lett.,2018
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