Meniscus-Confined Three-Dimensional Electrodeposition for Direct Writing of Wire Bonds
Author:
Affiliation:
1. Department of Mechanical Science and Engineering, University of Illinois, 1206 West Green Street, Urbana, IL 61801, USA.
Abstract
Publisher
American Association for the Advancement of Science (AAAS)
Subject
Multidisciplinary
Reference21 articles.
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2. G. Harman Wire Bonding in Microelectronics (McGraw-Hill New York 2009).
3. C. Harper Electronic Packaging and Interconnection Handbook (McGraw-Hill New York 2005).
4. International Technology Roadmap for Semiconductors (ITRS-2007) (www.itrs.net/Links/2007ITRS/Home2007.htm).
5. Free-space-wiring fabrication in nano-space by focused-ion-beam chemical vapor deposition
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