Direct In‐ and Out‐of‐Plane Writing of Metals on Insulators by Electron‐Beam‐Enabled, Confined Electrodeposition with Submicrometer Feature Size

Abstract

AbstractAdditive microfabrication processes based on localized electroplating enable the one‐step deposition of micro‐scale metal structures with outstanding performance, e.g., high electrical conductivity and mechanical strength. They are therefore evaluated as an exciting and enabling addition to the existing repertoire of microfabrication technologies. Yet, electrochemical processes are generally restricted to conductive or semiconductive substrates, precluding their application in the manufacturing of functional electric devices where direct deposition onto insulators is often required. Here, the direct, localized electrodeposition of copper on a variety of insulating substrates, namely Al2O3, glass and flexible polyethylene, is demonstrated, enabled by electron‐beam‐induced reduction in a highly confined liquid electrolyte reservoir. The nanometer‐size of the electrolyte reservoir, fed by electrohydrodynamic ejection, enables a minimal feature size on the order of 200 nm. The fact that the transient reservoir is established and stabilized by electrohydrodynamic ejection rather than specialized liquid cells can offer greater flexibility toward deposition on arbitrary substrate geometries and materials. Installed in a low‐vacuum scanning electron microscope, the setup further allows for operando, nanoscale observation and analysis of the manufacturing process.