Effects of deformation and applied temperature on the microstructure and performance of industrial ultra-thin rolled Cu foil-Reference-Cited by-同舟云学术

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Effects of deformation and applied temperature on the microstructure and performance of industrial ultra-thin rolled Cu foil

Published:2023-03 Issue: Volume:23 Page:4268-4279
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Dong Zhichao,Fei Xiangyu^ORCID,Feng Liu,Nie Jiwei,Li Weijie,Gong Benkui

Funder

Natural Science Foundation of Shandong Province

Major Scientific and Technological Innovation Project of Shandong Province

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference59 articles.

1. A novel approach for development of printed circuit board from biofiber based composites;Bharath;Polym Compos,2020

2. Analytical design of printed circuit board (PCB) metagratings for perfect anomalous reflection;Rabinovich;IEEE Trans Antenn Propag,2018

3. Printed circuit board (PCB) technology for electrochemical sensors and sensing platforms;Shamkhalichenar;Biosensors,2020

4. Materials and micro drilling of high frequency and high speed printed circuit board: a review;Shi;Int J Adv Manuf Technol,2019

5. The influence of pre-layer processing on the signal integrity of 5G high frequency communication multilayer LCP lines. 2021 5th IEEE Electron Devices Technol;Lai,2021

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructure and corrosion behaviour of metal copper parts formed by laser shock;Corrosion Science;2024-08

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