Thermal‐stress‐induced voiding in narrow, passivated Cu lines
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.107192
Reference14 articles.
1. The effects of alloying on stress induced void formation in aluminum‐based metallizations
2. Stress‐migration related electromigration damage mechanism in passivated, narrow interconnects
3. The effect of copper additions on electromigration in aluminum thin films
4. Thermal stress‐induced and electromigration‐induced void‐open failures in Al and Al–Cu fine lines
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