Thermal stress‐induced and electromigration‐induced void‐open failures in Al and Al–Cu fine lines
Author:
Publisher
American Vacuum Society
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
http://avs.scitation.org/doi/pdf/10.1116/1.577267
Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Fast Thermal Cycling-Enhanced Electromigration in Power Metallization;IEEE Transactions on Device and Materials Reliability;2004-06
2. Electromigration under time-varying current stress;Microelectronics Reliability;1998-03
3. Electromigration: A review;Microelectronics Reliability;1997-07
4. Stress voiding and electromigration phenomena in aluminum alloys;Applied Surface Science;1995-10
5. Effect of Annealing and Passivation on the Electromigration and Linewidth Dependence;MRS Proceedings;1995
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