The effect of copper additions on electromigration in aluminum thin films

Author:

D’heurle F. M.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Reference29 articles.

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4. P. P. Kuz’menko and E. I. Kharkov:Ukran. Fiz. Zhur., 1959, vol. 4, pp. 401-02.

5. R. V. Penney:J. Phys. Chem. Solids, 1964, vol. 25, pp. 335–45.

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