Aging process and strengthening mechanism of Cu–Cr–Ni alloy with superior stress relaxation resistance

Author:

Wang Guojie,Liu Haitao,Song KexingORCID,Zhou Yanjun,Cheng ChuORCID,Guo Huiwen,Guo Yingang,Tian Jing

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference48 articles.

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4. Prediction of the behaviour of copper alloy components under complex loadings by electro-thermomechanical coupled simulations;Weber;Mater Sci Technol,2018

5. Relaxation investigation on durability for terminals of CPU socket connectors;Liao;Mater Des,2009

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