Prediction of the behaviour of copper alloy components under complex loadings by electro-thermomechanical coupled simulations-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Prediction of the behaviour of copper alloy components under complex loadings by electro-thermomechanical coupled simulations

Published:2018-05-18 Issue:8 Volume:36 Page:899-905
ISSN:0267-0836
Container-title:Materials Science and Technology
language:en
Short-container-title:Materials Science and Technology

Author:

Weber M.¹,Helm D.¹^ORCID

Affiliation:

1. Fraunhofer Institute for Mechanics of Materials IWM, Freiburg, Germany

Funder

AiF within the program for sponsorship by Industrial Joint Research (IGF)

Ministry of Economic Affairs

Publisher

Informa UK Limited

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1080/02670836.2018.1471380

Reference9 articles.

1. A new ultrahigh strength Cu–Ni–Si alloy

2. Phase transformations and strengthening during ageing of CuNi10Al3 alloy

3. Microstructure and mechanical properties of Cu–Ni–Si alloys

4. Microstructure and Mechanical Properties of Cu-Ni-Si Alloys

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of trace alloying elements on stress relaxation properties of high strength and high conductivity C19160 alloy;Materials Science and Engineering: A;2024-08

2. Effect of Calefaction and Stress Relaxation on Grain Boundaries/Textures of Cu–Cr–Ni Alloy;Metals;2024-07-22

3. The Influence of Aging Temperatures on the Microstructure and Stress Relaxation Resistance of Cu-Cr-Ag-Si Alloy;Coatings;2024-07-20

4. Data-Driven Accelerated Parameter Identification for Chaboche-Type Visco-Plastic Material Models to Describe the Relaxation Behavior of Copper Alloys;Experimental Mechanics;2024-03-21

5. Effect of Low-Temperature Annealing on the Bending Properties of C19400 Copper Alloy Strips;Journal of Materials Engineering and Performance;2023-06-26

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3