Mechanical behavior investigation of press-fit connector based on finite element simulation and its reliability evaluation-Reference-Cited by-同舟云学术

Mechanical behavior investigation of press-fit connector based on finite element simulation and its reliability evaluation

Published:2021-01 Issue: Volume:116 Page:114010
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Wang Ruoyu,Xu Liangjun

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference29 articles.

1. Reliability of Press-Fit Pins in Printed Wiring Boards, the 12th Electrical/Electronics Insulation Conference, Boston, MA, USA;Tamburro,1975

2. Solderless press-fit interconnections: a mechanical study of solid and compliant contacts;Scaminaci;IEEE Transactions on Manufacturing Technology,1977

3. New LITESURF Plating for the Mitigation of Whisker Risks in Press-Fit Applications, the 63rd IEEE Holm Conference on Electrical Contacts;Crandall,2017

4. Utilizing Press-fit for Solderless Assembly of Pin Grid Connected Power Modules, 2007 PCIM Europe Conference;Thoben,2007

5. Press-fit Connector for Automobile ECUs, the 52nd IEEE Holm Conference on Electrical Contacts;Nomura,2006

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