Study on the microstructure and mechanism of stress relaxation behavior of Cu–Ni–Si alloy by two-stage rolling deformation-Reference-Cited by-同舟云学术

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Study on the microstructure and mechanism of stress relaxation behavior of Cu–Ni–Si alloy by two-stage rolling deformation

Published:2024-08 Issue: Volume:908 Page:146946
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Shan Yunqi,Zhang Yanmin^ORCID,Zhang Chaomin,Feng Jiang,Huang Baohuan,Zhao Shiheng^ORCID,Song Kexing

Funder

Key Scientific Research Project of Colleges and Universities in Henan Province

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference51 articles.

1. Simultaneous enhancement of mechanical and electrical properties of Cu–Ni–Si alloys via thermo-mechanical process;Wang;Mater Sci Eng A,2022

2. Effects of severe plastic deformation on transformation kinetics of precipitates in CuNi3Si1Mg;Gholami;Mater Sci Eng A,2016

3. Abnormally high work hardening ability and excellent comprehensive properties of copper alloys due to multiple twins and precipitates;Ban;Mater. Des.,2023

4. Microstructure and properties of Cu–Ni–Co–Si–Cr–Mg alloys with different Si contents after multi-step thermo-mechanical treatment;Ma;Mater Sci Eng A,2022

5. Simple optimization for strength and conductivity of Cu-Ni-Si alloy with discontinuous precipitation;Ahn;Mater. Char.,2022

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