Reliability of SnAgCuFe Solder Joints in WLCSP30 Device
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference19 articles.
1. Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate
2. Microstructures and Properties of SnZn Lead-Free Solder Joints Bearing La for Electronic Packaging
3. Comparison of spreading behaviour and interfacial microstructure in Sn–0·7Cu, Sn–0·3Ag–0·7Cu and Sn–2·5Ag–0·5Cu lead free solder alloys on Fe–42Ni substrate
4. Properties and microstructures of SnAgCu– x Eu alloys for concentrator silicon solar cells solder layer
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1. Experimental Study of the Rheology of Grease by the Example of CIATIM-221 and Identification of Its Behavior Model;Lubricants;2023-07-15
2. Reliability Enhancement of a Power Semiconductor With Optimized Solder Layer Thickness;IEEE Transactions on Power Electronics;2020-06
3. Solder joint failures under thermo-mechanical loading conditions – A review;Advances in Materials and Processing Technologies;2020-04-18
4. Mechanics-based acceleration for estimating thermal fatigue life of electronic packaging structure;Microelectronics Reliability;2020-04
5. Microstructures, interface reaction, and properties of Sn–Ag–Cu and Sn–Ag–Cu–0.5CuZnAl solders on Fe substrate;Journal of Materials Science: Materials in Electronics;2020-03-19
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