Properties and microstructures of SnAgCu– x Eu alloys for concentrator silicon solar cells solder layer-Reference-Cited by-同舟云学术

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Properties and microstructures of SnAgCu– x Eu alloys for concentrator silicon solar cells solder layer

Published:2014-11 Issue: Volume:130 Page:397-400
ISSN:0927-0248
Container-title:Solar Energy Materials and Solar Cells
language:en
Short-container-title:Solar Energy Materials and Solar Cells

Author:

Zhang Liang,Han Ji-guang,Guo Yong-huan,Sun Lei

Funder

Natural Science Foundation of Jiangsu Province

Natural Science Foundation of the Higher Education Institutions of Jiangsu Province

the Jiangsu University of Science and Technology: Provincial Key Lab of Advanced Welding Technology Foundation

Jiangsu Normal University Foundation

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Influence of Ni nanoparticle on morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate;Tay;Intermetallics,2013

2. Comparison of spreading behaviour and interfacial microstructure in Sn–0.7Cu, Sn–0.3Ag–0.7Cu and Sn–2.5Ag–0.5Cu lead-free solder alloys on Fe–42Ni substrate;Satyanarayan;Mater. Sci. Technol.,2013

3. Structure and properties of lead-free solders bearing micro and nano particles;Zhang;Mater. Sci. Eng. R,2014

4. Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments;Zhang;Mater. Sci. Eng. A,2014

5. A joint thermal-electrical analysis of void formation effects on concentrator silicon solar cells solder layer;Baricordi;Sol. Energy Mater. Sol. Cells,2013

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2. Effect of in Addition on Thermodynamic Properties, Wettability, Interface Microstructure, and Soldering Performance of SnBiAg–xIn/Cu Solder Joints;Metals;2022-09-25

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