Comparison of spreading behaviour and interfacial microstructure in Sn–0·7Cu, Sn–0·3Ag–0·7Cu and Sn–2·5Ag–0·5Cu lead free solder alloys on Fe–42Ni substrate

Author:

Narayan S,Prabhu K N

Publisher

Informa UK Limited

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference25 articles.

1. Hwang JS: ‘Implementing lead-free electronics’, 10–90; 2005, New York, McGraw-Hill.

2. Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy

3. Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

4. Effect of soldering condition on formation of intermetallic phases developed between Sn–0.3Ag–0.7Cu low-silver lead-free solder and Cu substrate

5. Lifeng W, Meina L, Yang L, Fenglian S: Proc. 6th Int. Forum on ‘Strategic technology’ (IFOST), Harbin, China, August 2011, IEEE, 169–172, 10.1109/IFOST.2011.6020995.

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