Funder
State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference30 articles.
1. M.Y. Xiong, L. Zhang, Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging. J. Mater. Sci. 54, 1741–1768 (2019)
2. M. Zhao, L. Zhang, Z.Q. Liu, M.Y. Xiong, L. Sun, Structure and properties of Sn-Cu lead-free solders in electronics packaging. Sci. Technol. Adv. Mater. 20(1), 421–444 (2019)
3. L. Zhang, Z.Q. Liu, Inhibition of intermetallic compounds growth at Sn-58Bi/Cu interface bearing CuZnAl memory particles (2–6μm). J. Mater. Sci.: Mater. Electron. 31, 2466–2480 (2020)
4. X.Y. Bi, X.W. Hu, X.X. Jiang, Q.L. Li, Effect of Cu additions on mechanical properties of Ni3Sn4-based intermetallic compounds: First-principles calculations and nano-indentation measurements. Vacuum 164, 7–14 (2019)
5. H.Y. Qiu, X.W. Hu, X.X. Jiang, Q.L. Li, The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration. Mater. Lett. 256, 126609 (2019)
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