Microstructures and shear properties of antimony- and indium-strengthened Sn5Bi/Cu joints-Reference-Cited by-同舟云学术

Microstructures and shear properties of antimony- and indium-strengthened Sn5Bi/Cu joints

Published:2024-04-25 Issue:3 Volume:7 Page:
ISSN:2522-0128
Container-title:Advanced Composites and Hybrid Materials
language:en
Short-container-title:Adv Compos Hybrid Mater

Author:

Zhang Jiaheng,Zhao Yongheng,Wang Xiaojing,Cai Shanshan,Peng Jubo,Liu Chen,Kallel Mohamed,El-Bahy Zeinhom M.,Wang Shuai,Liu Baosheng,Zhang Weibin,Chen Cai,Guo Fengyi,Wang Yingwu,El-Bahy Salah M.

Funder

Jiangsu Provincial Department of Science and Technology

Yunnan Provincial Science and Technology Department

Publisher

Springer Science and Business Media LLC

Link

https://link.springer.com/content/pdf/10.1007/s42114-024-00889-4.pdf

Reference62 articles.

1. Xue F, Gao W, Duan Y et al (2018) Design and characterization of a 12-bit 10MS/s 10mW pipelined SAR ADC for CZT-based hard X-ray imager. J Instrum 13(02):P02027

2. Zhang R, Chen C, Yu H et al (2021) All-solid-state wire-shaped asymmetric supercapacitor based on binder-free CuO nanowires on copper wire and PPy on carbon fiber electrodes. J Electroanal Chem 893:115323. https://doi.org/10.1016/j.jelechem.2021.115323

3. Hu Y, Gong YH, Zeng HH et al (2020) Two-dimensional stable Fe-based ferromagnetic semiconductors: FeI3 and FeI1.5Cl1.5 monolayers. Phys Chem Chem Phys 22(42):24506–24515. https://doi.org/10.1039/D0CP03991H

4. Huang W (2022) Polymers for flexible electronics. Chin J Polym Sci 40(12):1513–1514. https://doi.org/10.1007/s10118-022-2886-y

5. Chen J, Wang L, Xu X et al (2022) Self-healing materials-based electronic skin: mechanism, development and applications. Gels 8(6):356

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of Minor Zn Dopants in Sn-10Bi Solder on Interfacial Reaction and Shear Properties of Solder on Ni/Au Surface Finish;Materials;2024-09-03

2. Effect of trace Zn addition on electromigration of Cu/Sn–10Bi/Cu solder joints;Journal of Iron and Steel Research International;2024-08-12