The effect of postbake treatment on whisker growth under high temperature and humidity conditions on tin-plated Cu substrates
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference19 articles.
1. Driving force for the formation of Sn whiskers: compressive stress-pathways for its generation and remedies for its elimination and minimization
2. Tin whiskers studied by focused ion beam imaging and transmission electron microscopy
3. Spontaneous growth mechanism of tin whiskers
4. Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction
5. Whisker growth on surface treatment in the pure tin plating
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