Author:
Chang M. S.,Salleh Mohd Arif Anuar Mohd,Halin D. S. C.,Mokhtar N. Z. Mohd
Publisher
Springer International Publishing
Reference42 articles.
1. Batzill, M., & Diebold, U. (2005). The surface and materials science of tin oxide. Progress in Surface Science, 79(2–4), 47–154. https://doi.org/10.1016/j.progsurf.2005.09.002
2. Bozack, M. J., Snipes, S. K., & Flowers, G. N. (2016). Methods for fast, reliable growth of Sn whiskers. Surface Science, 652, 355–366. https://doi.org/10.1016/j.susc.2016.01.010
3. Choi, W. J., Lee, T. Y., Tu, K. N., Tamura, N., Celestre, R. S., MacDowell, A. A., & Nguyen, L. (2003). Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction. Acta Materialia, 51(20), 6253–6261. https://doi.org/10.1016/s1359-6454(03)00448-8
4. Chuang, T. (2006). Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints. Scripta Materialia, 55(11), 983–986. https://doi.org/10.1016/j.scriptamat.2006.08.024
5. Dittes, M., Odemdorff, P., Petit, L. (2003). Sn whisker formation-results, test methods and countermeasures. Paper presented at the Electronic Components and Technology Conference, Louisiana, USA.