Formation and Growth Mechanism of Laminar Cu 6 Sn 5 with Ultrafine Grains on Nanocrystalline Cu by Interfacial Reaction with Sn
Author:
Affiliation:
1. School of Materials Science and Engineering Dalian University of Technology Dalian 116024 P. R. China
Funder
National Natural Science Foundation of China
Publisher
Wiley
Subject
Mechanical Engineering,Mechanics of Materials
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/admi.202200732
Reference43 articles.
1. Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface
2. Elucidating Lithium Alloying-Induced Degradation Evolution in High-Capacity Electrodes
3. Heterostructured intermetallic CuSn catalysts: high performance towards the electrochemical reduction of CO2 to formate
4. Kinetic theory of flux-driven ripening
5. Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene
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1. Significant inhibition of interfacial Cu6Sn5 IMC and improvement of solder joint strength and reliability by applying (111) nanotwinned Cu substrate and vacuum soldering;Materials Characterization;2024-02
2. Study on the dual inhibition behavior of interfacial IMCs in Cu/SAC105/Cu joint by adopting SiC nanowires and nanocrystalline Cu substrate;Journal of Materials Research and Technology;2023-07
3. Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering;2023
4. Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering;2023
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