Study on the dual inhibition behavior of interfacial IMCs in Cu/SAC105/Cu joint by adopting SiC nanowires and nanocrystalline Cu substrate-Reference-Cited by-同舟云学术

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Study on the dual inhibition behavior of interfacial IMCs in Cu/SAC105/Cu joint by adopting SiC nanowires and nanocrystalline Cu substrate

Published:2023-07 Issue: Volume:25 Page:3754-3767
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Lu Xiao,Zhang Liang,Guo Yong-huan,Gao Li-Yin,Wang Xi,Chen Chen,Liu Zhi-Quan

Funder

National Natural Science Foundation of China

Jiangsu Normal University

Natural Science Foundation of Jiangsu Province

Basic and Applied Basic Research Foundation of Guangdong Province

Jiangsu Province Science and Technology Bureau

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference25 articles.

1. Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology;Tu;Mater Sci Eng R Rep,2019

2. Enhanced voiding in Cu-Sn micro joints;Njuki;Mater Res Bull,2022

3. Damage mechanism of Cu6Sn5 intermetallics due to cyclic polymorphic transitions;Zhang;Materials,2019

4. Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding;Guo;Solder Surf Mt Technol,2019

5. Effects of Ag flake addition in Sn-3.0Ag-0.5Cu on microstructure and mechanical properties with high-temperature storage test;Jang;J Electron Mater,2021

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interfacial reaction of Cu/SAC105/Cu solder joints reinforced with Ti nanoparticles under vacuum thermo-compression bonding;Journal of Materials Research and Technology;2024-03

2. Significant inhibition of interfacial Cu6Sn5 IMC and improvement of solder joint strength and reliability by applying (111) nanotwinned Cu substrate and vacuum soldering;Materials Characterization;2024-02

3. Enhancement of SAC105 solder for vacuum soldering with Cu substrates through incorporation of activated Ti nanoparticles;Journal of Materials Research and Technology;2024-01

4. Inserting auxeticity into graphene oxide via bottom-up strategy;Nanoscale;2024

5. Microstructure and orientation evolution of β-Sn and interfacial Cu6Sn5 IMC grains in SAC105 solder joints modified by Si3N4 nanowires;Journal of Materials Research and Technology;2023-09

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