Driving force for the formation of Sn whiskers: compressive stress-pathways for its generation and remedies for its elimination and minimization-Reference-Cited by-同舟云学术

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Driving force for the formation of Sn whiskers: compressive stress-pathways for its generation and remedies for its elimination and minimization

Published:2005-01 Issue:1 Volume:28 Page:31-35
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Chen Xu ,Yun Zhang ,Chonglun Fan ,Abys J.A.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/30861/01430807.pdf?arnumber=1430807

Cited by 67 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mitigation and Mechanism of Tin Whisker on Micro-bumps by Hard and Soft Underfills;Electronic Materials Letters;2022-10-25

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3. Tin Whiskers Growth in Electronic Assemblies;Recent Progress in Lead-Free Solder Technology;2022

4. Electrochemical dissolution and recovery of tin from printed circuit board in methane–sulfonic acid solution;Hydrometallurgy;2021-11

5. Effect of Electromigration and Thermal Ageing on the Tin Whiskers’ Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints;Coatings;2021-08-04

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