Mitigation and Mechanism of Tin Whisker on Micro-bumps by Hard and Soft Underfills
Author:
Funder
National Natural Science Foundation of China
Key Technologies Research and Development Program
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s13391-022-00372-6.pdf
Reference40 articles.
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2. Ebersberger, B., Lee, C.: Cu pillar bumps as a lead-free drop-in replacement for solder-bumped, flip-chip interconnects. In: 2008 58th Electronic Components and Technology Conference, pp. 59–66. Lake Buena Vista, FL (2008). https://doi.org/10.1109/ECTC.2008.4549951
3. Chen, Y.J., Chung, C.K., Yang, C.R., Kao, C.R.: Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics. Microelectron. Reliab. 53, 47–52 (2013). https://doi.org/10.1016/j.microrel.2012.06.116
4. Lai, Y.-S., Chiu, Y.-T., Chen, J.: Electromigration reliability and morphologies of Cu pillar flip-chip solder joints with Cu substrate pad metallization. J. Electron. Mater. 37, 1624–1630 (2008). https://doi.org/10.1007/s11664-008-0515-3
5. Lin, K., Wang, J., Yang, C., Sun, M., Hu, A., Wu, Y., Ling, H., Li, M.: Growth behavior of tin whisker and hillock on Cu/Ni/SnAg micro-bumps under high temperature and humidity storage. Mater. Lett. : X. 9, 100060 (2021). https://doi.org/10.1016/j.mlblux.2021.100060
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