Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process-Reference-Cited by-同舟云学术

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Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

Published:2017-01 Issue: Volume:186 Page:283-288
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Zhao H.Y.,Liu J.H.,Li Z.L.,Zhao Y.X.,Niu H.W.,Song X.G.,Dong H.J.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference12 articles.

1. Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal condition

2. Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

3. Strength of joints produced by transient liquid phase bonding in the Cu–Sn system

4. On the mechanism of the binary Cu/Sn solder reaction

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2. Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform;Journal of Materials Science: Materials in Electronics;2024-07

3. Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints;Journal of Materials Science;2024-04-13

4. Ultrasonic-enhanced silver‑indium transient liquid phase bonding in advancing rapid and low-temperature packaging;Materials Characterization;2024-04

5. Progress of Interconnect Materials in the Third-generation Semiconductor and Their Low-temperature Sintering of Copper Nanoparticles;Journal of Inorganic Materials;2024

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