On the mechanism of the binary Cu/Sn solder reaction
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1852724
Reference8 articles.
1. Tin–lead (SnPb) solder reaction in flip chip technology
2. Three‐dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu
3. Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening
4. Wetting reaction versus solid state aging of eutectic SnPb on Cu
5. Kinetic theory of flux-driven ripening
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