An in situ elemental migration on a nanosize Cu–Sn interface in a microscope-Reference-Cited by-同舟云学术

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An in situ elemental migration on a nanosize Cu–Sn interface in a microscope

Published:2023-09 Issue: Volume:26 Page:7757-7766
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Li Ang^ORCID,Tao Yu,Lu Hui,Qiao Shihang,Liu Shanshan,Jiao Yilin,Xie Lilin,Chen Yanhui^ORCID

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference31 articles.

1. Investigation of FeCoNiCu properties: thermal stability, corrosion behavior, wettability with Sn-3.0Ag-0.5Cu and interlayer formation of multi-element intermetallic compound;Shen;Appl Surf Sci,2021

2. Design and performance of Ag nanoparticle-modified graphene/SnAgCu lead-free solders;Xu;Mater Sci Eng, A,2016

3. Interface and marker movements in diffusion in solid solutions of metals;Dasilva;J Met,1951

4. Interfacial reactions between lead-free solders and common base materials;Laurila;Mater Sci Eng R Rep,2005

5. Six cases of reliability study of Pb-free solder joints in electronic packaging technology;Zeng;Mater Sci Eng R Rep,2002

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