Thick film patterning by lift-off process using double-coated single photoresists
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference11 articles.
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1. Double Coating Process Using the Single Photoresist and the Thickness Prediction;IEEE Transactions on Semiconductor Manufacturing;2021-11
2. A metal lift-off process through hyperbolic undercut of laser heat-mode lithography;Materials Letters;2020-04
3. Thermal Characterization of Low-Dimensional Materials by Resistance Thermometers;Materials;2019-05-29
4. Taguchi Design of Experiment Enabling the Reduction of Spikes on the Sides of Patterned Thin Films for Tunnel Junction Fabrication;MRS Advances;2017-06-22
5. Development of Lift-off Photoresists with Unique Bottom Profile;Transactions of The Japan Institute of Electronics Packaging;2015
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