Effect of nano Ni additions on the structure and properties of Sn–9Zn and Sn–Zn–3Bi solders in Au/Ni/Cu ball grid array packages
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference14 articles.
1. Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints
2. Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder
3. Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications
4. Effect of Zn addition, strain rate and deformation temperature on the tensile properties of Sn–3.3 wt.% Ag solder alloy
5. Investigation of interfacial reactions between Sn–Zn solder with electrolytic Ni and electroless Ni(P) metallization
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1. Experimental determination and high-throughput calculation of the interdiffusion coefficient matrix and atomic mobility in Ag-rich fcc Ag–Sn–Zn alloys;Calphad;2023-12
2. Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO2 nanoparticles via vacuum melting process;Physica Scripta;2023-09-05
3. Study on the effects of Ag addition on the mechanical properties and oxidation resistance of Sn–Zn lead-free solder alloy by high-throughput method;Journal of Materials Science: Materials in Electronics;2023-01-31
4. Interfacial reaction between Ni particle reinforcements and liquid Sn-based eutectic solders;Soldering & Surface Mount Technology;2021-02-15
5. Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys;Journal of Nanomaterials;2020-12-14
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