Effect of Zn addition, strain rate and deformation temperature on the tensile properties of Sn–3.3 wt.% Ag solder alloy
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference22 articles.
1. Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys
2. The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn-Ag/Cu solder joints
3. Micromechanics in Solder Materials Used for Microelectronic Applications
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1. Evolution of interfacial IMCs and mechanical properties of Sn–Ag–Cu solder joints with Cu-modified carbon nanotube;Journal of Materials Science: Materials in Electronics;2022-07-29
2. Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys;Materials Science-Poland;2020-03-01
3. Relationship of Mechanical and Micromechanical Properties with Microstructural Evolution of Sn-3.0Ag-0.5Cu (SAC305) Solder Wire Under Varied Tensile Strain Rates and Temperatures;Journal of Electronic Materials;2019-02-08
4. Effect of addition of GO Nanoparticles on the tensile properties and deformation temperature of Sn-3.5Ag-0.7Cu lead free solder alloy;Arab Journal of Nuclear Sciences and Applications;2018-12-09
5. Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni;Journal of Alloys and Compounds;2017-02
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