Investigation of interfacial reactions between Sn–Zn solder with electrolytic Ni and electroless Ni(P) metallization
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference20 articles.
1. A thermodynamic study on the AgSbSn system
2. Lead-free Solders in Microelectronics
3. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
4. Thermodynamic calculation of the In–Sn–Zn ternary system
5. Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints
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4. Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study;Soldering & Surface Mount Technology;2018-06-04
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