Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints-Reference-Cited by-同舟云学术

Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints

Published:2006-04 Issue:1-2 Volume:414 Page:123-130
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Zhong W.H.,Chan Y.C.,Alam M.O.,Wu B.Y.,Guan J.F.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference27 articles.

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3. A.J. Rafanelli, The Lead-Free Solder Alternatives Issue: A Defense Industry Perspective. http://www.smta.org/files/smta_boston01_rafanelli.pdf.

4. Proceedings of the Third EPTC;Garner,2000

5. Proceedings of the Fourth International Symposium of EMP;Casey,2002

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