Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints
Author:
Funder
National Natural Science Foundation of China
China Postdoctoral Science Foundation
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s11664-024-11350-z.pdf
Reference15 articles.
1. W.A. Siswanto, M. Arun, I.V. Krasnopevtseva, A. Surendar, and A. Maseleno, A competition between stress triaxiality and joule heating on microstructure evolution and degradation of SnAgCu solder joints. J. Manuf. Process. 54, 221 (2020). https://doi.org/10.1016/j.jmapro.2020.03.016.
2. Y.H. Jo, J.W. Lee, S.K. Seo, H.M. Lee, H. Han, and D.C. Lee, Demonstration and characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag combination solder for 3-D multistack packaging. J. Electron. Mater. 37, 110 (2008). https://doi.org/10.1007/s11664-007-0296-0.
3. T.T. Chou, R.W. Song, H. Chen, and J.G. Duh, Low thermal budget bonding for 3D-package by collapse-free hybrid solder. Mater. Chem. Phys. 238, 121887 (2019). https://doi.org/10.1016/j.matchemphys.2019.121887.
4. J.H. Wang, L. Wen, J.W. Zhou, and M.K. Chung, Mechanical properties and joint reliability improvement of Sn-Bi alloy. IEEE Electron. Packag. Technol. Conf. (2011). https://doi.org/10.1109/EPTC.2011.6184470.
5. J. Ren, and M.L. Huang, Board-level drop reliability and fracture behavior of low-temperature soldering Sn-Ag-Cu/Sn-Bi-X hybrid BGA solder joints for consumer electronics. J. Mater. Sci. Mater. Electron. 32, 15453 (2021). https://doi.org/10.1007/s10854-021-06094-z.
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