Demonstration and Characterization of Sn-3.0Ag-0.5Cu/ Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging-Reference-Cited by-同舟云学术

Demonstration and Characterization of Sn-3.0Ag-0.5Cu/ Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging

Published:2007-11-14 Issue:1 Volume:37 Page:110-117
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Jo Yun-Hwan,Lee Joo Won,Seo Sun-Kyoung,Lee Hyuck Mo,Han Hun,Lee Dong Chun

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-007-0296-0.pdf

Reference22 articles.

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3. R. Shukla, V. Murali, and A. Bhansali, Proceedings of the 49th Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 1999), pp. 945–949

4. J.-W. Nah, J.H. Kim, H.M. Lee, and K.-W. Paik, Acta Mater. 52, 129 (2004)

5. D.O. Powell and A.K. Trivedi, Proceedings of the 43th Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 1993), pp.182–186

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