Investigating the dynamic changes of the vapour concentration in a Vapour Phase Soldering oven by simplified condensation modelling-Reference-Cited by-同舟云学术

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Investigating the dynamic changes of the vapour concentration in a Vapour Phase Soldering oven by simplified condensation modelling

Published:2013-09 Issue:1-2 Volume:59 Page:94-100
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Illés Balázs,Géczy Attila

Funder

János Bolyai Research Scholarship of the Hungarian Academy of Sciences

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference17 articles.

1. Estimation of the vapor pressure of PFPEs by TGA;Bassi;Thermochim. Acta,2011

2. Investigations on vapor phase soldering process in an experimental soldering station;Géczy;Micro Nanosyst.,2012

3. Investigating the mechanical strength of vapor phase soldered chip components joints;Krammer,2010

4. Formation, distribution and failure effects of voids in vapor–phase soldered small solder volumes;Villain,2000

5. Soldering techniques, vapor–phase reflow soldering;Freedman,2008

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1. Improving efficiency of vapour phase soldering ovens with pressure and temperature-based process monitoring;Case Studies in Thermal Engineering;2024-05

2. Compact numerical modelling of transient condensate layer formation on small components during vapour phase soldering;International Communications in Heat and Mass Transfer;2022-06

3. Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process;Metals;2021-07-21

4. Research on Thermal Simulation Improving the Components’ Soldering Quality in Electronic Module;Journal of Physics: Conference Series;2021-07-01

5. Heat Level Mode in Vapour Phase Soldering Using Lead-Free Solder Paste for Surface Mount Technology: A Review;Lecture Notes in Mechanical Engineering;2021

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