Effect of Ag addition on the structures of intermetallic compounds and the adhesion strength of the Sn–9Zn–xAg/Cu interface
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Inorganic Chemistry,Condensed Matter Physics
Reference28 articles.
1. Interfacial reactions in Ag-Sn/Cu couples
2. Modeling the solid-state reaction between Sn-Pb solder and a porous substrate coating
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1. Effect of bismuth and silver on the corrosion behavior of Sn–9Zn alloy in NaCl 3wt.% solution;Materials Science and Engineering: B;2011-08
2. Microstructure and adhesion strength of Sn–9Zn–1.5Ag–xBi (x=0wt% and 2wt%)/Cu after electrochemical polarization in a 3.5wt% NaCl solution;Journal of Alloys and Compounds;2008-08
3. Phase transformation and morphology of the intermetallic compounds formed at the Sn–9Zn–3.5Ag/Cu interface in aging;Journal of Alloys and Compounds;2008-06
4. Electrochemical Properties of Joints Formed Between Sn-9Zn-1.5Ag-1Bi Alloys and Cu Substrates in a 3.5 wt.% NaCl Solution;Journal of Electronic Materials;2007-09-11
5. Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface;MATERIALS TRANSACTIONS;2007
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