Microstructure and adhesion strength of Sn–9Zn–1.5Ag–xBi (x=0wt% and 2wt%)/Cu after electrochemical polarization in a 3.5wt% NaCl solution-Reference-Cited by-同舟云学术

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Microstructure and adhesion strength of Sn–9Zn–1.5Ag–xBi (x=0wt% and 2wt%)/Cu after electrochemical polarization in a 3.5wt% NaCl solution

Published:2008-08 Issue:1-2 Volume:461 Page:160-165
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Li Wang-Long,Chen Ying-Ru,Chang Kuo-Ming,Liu Chih-Yao,Hon Min-Hsiung,Wang Moo-Chin

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference26 articles.

1. Metallurgy of low temperature Pb-free solders for electronic assembly

2. Lead-free Solders in Microelectronics

3. Improved mechanical properties in new, Pb-free solder alloys

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Corrosion characterization of Sn-Zn solder: a review;Soldering & Surface Mount Technology;2019-02-18

2. Corrosion measurement on shear strength of Cu/Sn–9Zn/Cu lap joints;Measurement;2015-04

3. Morphology and Intermetallic Study of (Sn-8Zn-3Bi)-1Ni Solder under Liquid State Aging;Advanced Materials Research;2015-02

4. Corrosion measurement of Sn–Zn lead-free solders in 6 M KOH solution;Measurement;2014-01

5. The corrosion of tin under thin electrolyte layers containing chloride;Corrosion Science;2013-01

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