Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface-Reference-Cited by-同舟云学术

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Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface

Published:2007 Issue:8 Volume:48 Page:2133-2138
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Liu Chih-Yao¹,Chen Ying-Ru²,Li Wang-Long²³,Hon Min-Hsiung¹,Wang Moo-Chin⁴

Affiliation:

1. Department of Materials Science and Engineering, National Cheng Kung University

2. Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences

3. Institute of Nanotechnology and Microsystems Engineering, National Cheng Kung University

4. Faculty of Fragrance and Cosmetics, Kaohsiung Medical University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/48/8/48_MRA2007075/_pdf

Reference22 articles.

1. 1) M. L. Huang, T. Loeher, A. Ostmann and H. Reichl: Appl. Phys. Lett. 86 (2005) 181908–181910.

2. 2) H. K. Kim and K. N. Tu: Phys. Rev. B53 (1996) 16027–16034.

3. 3) G. Ghosh: Matall. Mater. Trans. A30 (1999) 1481–1494.

4. 4) X. J. Liu, M. Kinaka, Y. Takaku, I. Ohnuma, R. Kainuma and K. Ishida: J. Electron. Mater. 34 (2005) 670–679.

5. 5) I. Shohji, T. Yoshida, T. Takahashi and S. Hioki: Mater. Trans. 43 (2002) 1854–1857.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys;Journal of Alloys and Compounds;2014-01

2. Effects of Thermal Storage and Cu Addition on Adhesive Strength and Microstructure of Sn-3.0 mass% Ag-1.5 mass% Sb-xCu Solder Joints;MATERIALS TRANSACTIONS;2009

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