Phase transformation and morphology of the intermetallic compounds formed at the Sn–9Zn–3.5Ag/Cu interface in aging
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference35 articles.
1. The role of intermetallic compounds in lead‐free soldering
2. Formation of intermetallic compounds at eutectic Sn–Zn–Al solder/Cu interface
3. Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages
4. Heat Resistance of Sn–9Zn Solder/Cu Interface with or without Coating
5. Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu
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3. A critical review on performance, microstructure and corrosion resistance of Pb-free solders;Measurement;2019-02
4. An Ab-initio study of structural, elastic, electronic and thermodynamic properties of triclinic Cu 7 In 3;Materials Chemistry and Physics;2016-05
5. Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties;Journal of Alloys and Compounds;2014-02
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