Electrical property improvement of dicyandiamide-cured electrically conductive adhesives through in-situ replacement by difunctional acids and the impact on storage-Reference-Cited by-同舟云学术

Electrical property improvement of dicyandiamide-cured electrically conductive adhesives through in-situ replacement by difunctional acids and the impact on storage

Published:2013-09 Issue: Volume:45 Page:132-137
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Wang Ling,Wan Chao,Wang Hongqin,Chen Hongtao,Zhu XiaoMeng,Li Mingyu

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference14 articles.

1. Electronics without lead;Li;Science,2005

2. Environment-friendly electronics: lead-free technology;Hwang,2001

3. Electronics manufacturing: with lead-free, halogen-free, and conductive adhesive materials;Lau,2002

4. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications;Li;Mater Sci Eng R: Rep,2006

5. A novel approach to stabilize contact resistance of electrically conductive adhesives on lead-free alloy surfaces;Li;J Electron Mater,2004

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4. The Application of Nano Carbon Based Materials in Electrical Conductive Adhesives;PROG CHEM;2015

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