Author:
Marcus Steven D.,Foster R.F.
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. Proc. Int. Electron Devices Meet.;Travis,1990
2. Advanced Metallization for ULSI Applications;Hillman,1992
3. Proc. IEEE VLSI Multilevel Interconnect Conf.;Hillman,1992
4. Titanium nitride for antireflection control and hillock suppression on aluminum silicon metallization
5. TiN formed by evaporation as a diffusion barrier between Al and Si
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38 articles.
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