Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
Author:
Funder
Yeungnam University
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
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3. WNx diffusion barriers between Si and Cu;Uekubo;Thin Solid Films,1996
4. Properties of reactively sputtered WNx as Cu diffusion barrier;Suh;Thin Solid Films,1999
5. Interface studies of tungsten nitride and titanium nitride composite metal gate electrodes with thin dielectric layers;Claflin;J. Vac. Sci. Technol. A,1998
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